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[SE05x] Logic to track signature calls for attestation is removed #23207
Merged
andy31415
merged 22 commits into
project-chip:master
from
sujaygkulkarni-nxp:feature/se05x-t4t-support
Nov 3, 2022
Merged
[SE05x] Logic to track signature calls for attestation is removed #23207
andy31415
merged 22 commits into
project-chip:master
from
sujaygkulkarni-nxp:feature/se05x-t4t-support
Nov 3, 2022
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PR #23207: Size comparison from 9f08fc1 to 7ac71a6 Increases (9 builds for bl602, bl702, esp32, psoc6, telink)
Decreases (3 builds for bl702, esp32, telink)
Full report (33 builds for bl602, bl702, cc13x2_26x2, cyw30739, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #23207: Size comparison from 9f08fc1 to fe6df6b Increases (3 builds for bl702, telink)
Decreases (2 builds for bl702, telink)
Full report (10 builds for bl702, linux, mbed, nrfconnect, telink)
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PR #23207: Size comparison from 9f08fc1 to f20f459 Increases (7 builds for bl602, bl702, cc13x2_26x2, psoc6, telink)
Decreases (3 builds for cc13x2_26x2, esp32, qpg)
Full report (38 builds for bl602, bl702, cc13x2_26x2, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #23207: Size comparison from 9f08fc1 to 02ea2de Increases (3 builds for cc13x2_26x2, telink)
Decreases (7 builds for bl702, cc13x2_26x2, nrfconnect, psoc6, telink)
Full report (38 builds for bl602, bl702, cc13x2_26x2, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
|
bzbarsky-apple
requested changes
Oct 18, 2022
examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp
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PR #23207: Size comparison from 66c0270 to 68001b8 Increases (11 builds for bl602, cc13x2_26x2, esp32, k32w, psoc6, qpg, telink)
Decreases (2 builds for cc13x2_26x2, esp32)
Full report (38 builds for bl602, bl702, cc13x2_26x2, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp
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examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp
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bzbarsky-apple
approved these changes
Oct 24, 2022
examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp
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…_v2.cpp Co-authored-by: Boris Zbarsky <[email protected]>
PR #23207: Size comparison from 0c2f7c6 to cc53d45 Increases (8 builds for bl602, bl702, cc13x2_26x2, nrfconnect, psoc6, qpg)
Decreases (4 builds for cc13x2_26x2, esp32, psoc6)
Full report (33 builds for bl602, bl702, cc13x2_26x2, cyw30739, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #23207: Size comparison from 0c2f7c6 to ccb2cb2 Increases (7 builds for bl702, cc13x2_26x2, nrfconnect, psoc6, qpg, telink)
Decreases (6 builds for cc13x2_26x2, cyw30739, esp32, psoc6, telink)
Full report (38 builds for bl602, bl702, cc13x2_26x2, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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PR #23207: Size comparison from 2fd0202 to c2869e5 Increases (7 builds for cc13x2_26x2, esp32, psoc6, telink)
Decreases (4 builds for bl602, bl702, cc13x2_26x2)
Full report (47 builds for bl602, bl702, cc13x2_26x2, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, telink)
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adbridge
pushed a commit
to ARM-software/connectedhomeip
that referenced
this pull request
Nov 18, 2022
…oject-chip#23207) * added readme for se05x example * changed device attestation - Logic to track attestation calls removed * updated simw build files * reverting changes * reverting changes * using chip_device_platform * updated simw package repo * restyler-diff * restyler-diff * updated simw-repo submodule * updated device attestation provider to handle TLV errors * removed extra semicolon restyler * updated comments in DAC provider * making only TAG3 optional * spell check * updated comments * Update examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp Co-authored-by: Boris Zbarsky <[email protected]> * restyle-diff Co-authored-by: Boris Zbarsky <[email protected]>
adbridge
pushed a commit
to ARM-software/connectedhomeip
that referenced
this pull request
Nov 18, 2022
…oject-chip#23207) * added readme for se05x example * changed device attestation - Logic to track attestation calls removed * updated simw build files * reverting changes * reverting changes * using chip_device_platform * updated simw package repo * restyler-diff * restyler-diff * updated simw-repo submodule * updated device attestation provider to handle TLV errors * removed extra semicolon restyler * updated comments in DAC provider * making only TAG3 optional * spell check * updated comments * Update examples/platform/nxp/se05x/DeviceAttestationSe05xCredsExample_v2.cpp Co-authored-by: Boris Zbarsky <[email protected]> * restyle-diff Co-authored-by: Boris Zbarsky <[email protected]>
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Problem
Remove the logic to track signature calls for attestation
Fixed #23064
Change overview
Testing
Tested using the thermostat example and chip tool for connectivity